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CUTTER DEVICE FOR SIDE DITCH, AND METHOD FOR REPAIRING SIDE DITCH

机译:用于侧沟的切割器装置以及用于修复侧沟的方法

摘要

PROBLEM TO BE SOLVED: To facilitate repair of a side ditch, which can eliminate a poor appearance of a deteriorated top surface of a side wall, when repairing the side ditch.;SOLUTION: A cutter device comprises a base portion that has wheels traveling on lid receiving surfaces of top portions of both right and left side walls of a side ditch and that can move in the length direction of the side ditch between both the side walls, and a cutter with a disk blade, which is mounted on the base portion. An outer peripheral portion of the disk blade is protruded in the lateral direction of the base portion. The cutter device horizontally cuts the side wall of the side ditch along a length direction while moving the base portion in the length direction of the side ditch. The use of the cutter device enables the easy cutting of the top portion of the side wall of the side ditch, and facilitates the repair of the side ditch, which can eliminate a poor appearance of the top surface of the side wall.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:在修理侧沟时,为了便于修理侧沟,这可以消除侧壁劣化的顶面的不良外观。解决方案:切割装置包括具有在其上行进的轮的基部。能够在两个侧壁之间沿该侧面沟槽的长度方向移动的侧面沟槽的左右侧壁的顶部的盖接收表面,以及具有圆盘刀片的刀具,该刀具安装在基部上。盘片的外周部在基部的宽度方向上突出。切割器装置在使基部在侧沟的长度方向上移动的同时,沿着长度方向水平地切割侧沟的侧壁。使用切割器装置可以容易地切割侧沟的侧壁的顶部,并且有利于侧沟的修复,这可以消除侧壁的顶表面的不良外观。 (C)2012,日本特许厅&INPIT

著录项

  • 公开/公告号JP2012122232A

    专利类型

  • 公开/公告日2012-06-28

    原文格式PDF

  • 申请/专利权人 CHUETSU SEITO KK;

    申请/专利号JP20100272859

  • 发明设计人 SANO KENICHI;

    申请日2010-12-07

  • 分类号E03F5/04;E03F7/00;B28D1/04;

  • 国家 JP

  • 入库时间 2022-08-21 17:42:46

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