首页> 外国专利> MANUFACTURING METHOD OF MICROCHIP WITH ELECTRODE, AND MICROCHIP WITH ELECTRODE MANUFACTURED BY THE MANUFACTURING METHOD

MANUFACTURING METHOD OF MICROCHIP WITH ELECTRODE, AND MICROCHIP WITH ELECTRODE MANUFACTURED BY THE MANUFACTURING METHOD

机译:带有电极的微芯片的制造方法以及由该方法制造的带有电极的微芯片

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a microchip with electrodes in which adhesion of two substrates including electrode portions can be firmly performed without remaining of foreign matter in a flow passage at all and the manufacturing cost can be reduced, and to provide the microchip with electrodes manufactured by the manufacturing method.;SOLUTION: Disclosed is the manufacturing method of a microchip with electrodes which is manufactured by joining two substrate members with each other and has at least the flow passage and the electrodes connected to the flow passage on the joining surface. The manufacturing method includes: a step of joining the two substrate members with each other; a first joining step of joining portions other than the vicinity of the electrodes of the substrate members; and a second joining step of joining the portions in the vicinity of electrodes of the substrate members. The microchip is provided which is manufactured by the manufacturing method.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种具有电极的微芯片的制造方法,其中可以牢固地进行包括电极部分的两个基板的粘附,而根本没有异物残留在流道中,并且可以降低制造成本。解决方案:本发明公开了一种带有电极的微芯片的制造方法,该方法是通过将两个基板构件彼此接合并且至少具有流道和连接到流道的电极而制造的。接合面。该制造方法包括:将两个基板构件彼此接合的步骤;以及将两个基板构件彼此接合的步骤。第一接合步骤,接合基板构件的电极附近以外的部分。第二接合步骤是接合基板构件的电极附近的部分。提供通过制造方法制造的微芯片。版权所有:(C)2012,JPO&INPIT

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