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The thermosetting metaplasia polyamide imido resin composition, polyamide imido resin hardening ones, the insulated wire and the formation belt

机译:热固性化生聚酰胺酰亚胺树脂组合物,聚酰胺酰亚胺树脂硬化剂,绝缘电线和成型带

摘要

PROBLEM TO BE SOLVED: To provide a polyamideimide resin composition capable of yielding a cured product maintaining flexibility and stretchability inherent in a polyamideimide resin and having improved mechanical strength, and an insulated electric wire and a molded belt produced by using the same.;SOLUTION: A thermosetting polyamideimide resin composition containing a polyamideimide resin (1) comprising a polyamideimide resin having a carboxy group and/or an acid anhydride group at its molecular terminal or a polyamideimide resin having a carboxy group and/or an acid anhydride group at its molecular terminal in which the molecular terminal group may be blocked by a terminal blocking agent, and a polyamideimide resin (2) comprising a polyamideimide resin having an isocyanate group at the molecular terminal or a polyamideimide resin having an isocyanate group at the molecular terminal in which the molecular terminal group may be blocked by a terminal blocking agent, is used.;COPYRIGHT: (C)2007,JPO&INPIT
机译:要解决的问题:提供一种聚酰胺酰亚胺树脂组合物,该组合物能够产生保持聚酰胺酰亚胺树脂固有的柔韧性和可拉伸性并且具有改善的机械强度的固化产物,以及使用该组合物生产的绝缘电线和成型带。一种热固性聚酰胺酰亚胺树脂组合物,其包含聚酰胺酰亚胺树脂(1),该聚酰胺酰亚胺树脂在其分子末端具有羧基和/或酸酐基的聚酰胺酰亚胺树脂或在分子末端具有羧基和/或酸酐基的聚酰胺酰亚胺树脂。其中分子末端基团可以被末端封闭剂封闭的聚酰胺酰亚胺树脂(2),其包括在分子末端具有异氰酸酯基的聚酰胺酰亚胺树脂或在分子末端具有异氰酸酯基的聚酰胺酰亚胺树脂。终端组可能被终端阻断剂所阻断。使用:COPYRIGHT: (C)2007,日本特许厅&INPIT

著录项

  • 公开/公告号JP5024517B2

    专利类型

  • 公开/公告日2012-09-12

    原文格式PDF

  • 申请/专利权人 荒川化学工業株式会社;

    申请/专利号JP20060241974

  • 发明设计人 濱澤 晃久;合田 秀樹;西村 浩司;

    申请日2006-09-06

  • 分类号C08L79/08;C08G18/60;C08G18/80;H01B7/02;H01B3/30;

  • 国家 JP

  • 入库时间 2022-08-21 17:41:39

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