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ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD FOR CHANGING LOWER RECEIVING UNITS IN THE SAME
ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD FOR CHANGING LOWER RECEIVING UNITS IN THE SAME
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机译:电子部件安装装置和在同一部件中更换下部接收单元的方法
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摘要
PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus and a method for changing lower receiving units in the electronic component mounting apparatus, which is adapted to facilitate replacement of the lower receiving unit of a board conveyance path.;SOLUTION: When a lower receiving unit 24 installed in a board conveyance path 13a closer to an operator OP than the other of two board conveyance paths 13 provided on a base 12 at a level and in parallel to each other is replaced, the lower receiving unit 24 installed in the board conveyance path 13a closer to the operator OP than the other is raised to a first height H1 which is higher than a height H0 at which a board 2 is supported. Also, when a lower receiving unit 24 installed in a board conveyance path 13b farther from the operator OP than the other is replaced, it is raised to a second height H2 which is higher than the height of the lower receiving unit 24 (first height H1) at which the lower receiving unit 24 installed in the board conveyance path 13a closer to the operator OP than the other is replaced.;COPYRIGHT: (C)2012,JPO&INPIT
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