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HIGH POWER LASER PROCESSING HEAD AND HIGH POWER LASER PROCESSING METHOD

机译:大功率激光加工头和大功率激光加工方法

摘要

PROBLEM TO BE SOLVED: To provide a high power laser processing head having the function of monitoring the accumulation of spatter ejected from a workpiece via a probe beam which can implement precise and sensitive detection by suppressing effects of variations in probe beam position and reducing effects of low frequency noise.SOLUTION: The high power laser processing head includes a condenser lens 1 for focusing processing laser light 3 modulated in power to a fixed frequency of 100 Hz to 10,000 Hz on a workpiece, a cover glass 5 positioned between the condenser lens 1 and the workpiece 4, a light source 8 for radiating a probe beam 6 to the cover glass 5, a position sensor 7 for detecting the deflection direction of the probe beam 6 transmitted through or reflected by the cover glass 5, and a signal processing circuit for extracting a frequency component centered on the modulation frequency of the processing laser light 3 from the output signal from the position sensor 7. The amplitude of the extracted signal is evaluated as the amount of absorbing impurities attached to the cover glass 5.
机译:解决的问题:提供一种高功率激光加工头,该激光加工头具有通过探针束监视从工件喷出的飞溅物的堆积的功能,通过抑制探针束位置的变化的影响并减小探针的影响,可以进行精确且灵敏的检测。解决方案:高功率激光处理头包括一个聚光镜1,用于将功率调制为100 Hz到10,000 Hz固定频率的激光3聚焦在加工的激光3上;位于聚光镜1之间的防护玻璃5。工件4,用于将探测光束6辐射到防护玻璃5的光源8,用于检测透射通过防护玻璃5或由防护玻璃5反射的探测光束6的偏转方向的位置传感器7以及信号处理电路用于从位置传感器7的输出信号中提取以处理激光3的调制频率为中心的频率分量。将提取信号的e评估为附着在防护玻璃5上的吸收杂质的量。

著录项

  • 公开/公告号JP2011240389A

    专利类型

  • 公开/公告日2011-12-01

    原文格式PDF

  • 申请/专利权人 AMADA CO LTD;

    申请/专利号JP20100116138

  • 发明设计人 JEAN-FRANCOIS BISSON;UMEDA JUNYA;

    申请日2010-05-20

  • 分类号B23K26;B23K26/06;G01B11/30;

  • 国家 JP

  • 入库时间 2022-08-21 17:40:14

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