首页> 外国专利> In the inside diameter measurement equipment of the glass substrate for the disk and the inside diameter measurement equipment which measures inside diameter measuring method, the production manner of the glass substrate for the

In the inside diameter measurement equipment of the glass substrate for the disk and the inside diameter measurement equipment which measures inside diameter measuring method, the production manner of the glass substrate for the

机译:在用于盘的玻璃基板的内径测量设备和测量内径测量方法的内径测量设备中,用于玻璃的玻璃基板的生产方式

摘要

PROBLEM TO BE SOLVED: To provide a noncontact disk substrate inside diameter measurement apparatus for enabling an accurate measurement, and preventing a to-be-measured object from being damaged during the measurement.;SOLUTION: A laser displacement gauge 100 for measuring an inside diameter of a disk substrate 200 with a circular hole 210 formed in the center includes: a line laser light source 110 for irradiating a main surface of the disk substrate with a line laser 112; a substrate holder 130 for supporting the disk substrate 200; a lifting section 140 for lifting the substrate holder 130 or the line laser light source 110 so as to pass the line laser 112 through the circular hole 210 of the disk substrate 200; a light receiving section 120 for receiving the line laser 112 reflected by or passing through the disk substrate 200, and obtaining a distribution of the light quantity while the substrate holder 130 or the line laser light source 110 is lifted; and an inside diameter measuring section 150 for measuring the inside diameter of the circular hole 210 from the distribution of the light quantity obtained by the light receiving section 120. The substrate holder 130 supports the disk substrate 200 at three supporting points 220A-220C.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种非接触盘基板内径测量设备,以实现精确的测量,并防止在测​​量过程中损坏被测物。解决方案:用于测量内径的激光位移计100在中心形成有圆孔210的盘基板200,具有:线激光光源110,该线激光光源110用线激光器112照射盘基板的主面。基板保持器130,用于支撑盘基板200。升降部140,其用于使基板支架130或线状激光光源110上升,以使线状激光112穿过盘状基板200的圆孔210。光接收部分120,用于接收被磁盘基底200反射或穿过盘基底200的线激光器112,并在抬起基底支架130或线激光器光源110的同时获得光量的分布;基板支架130在三个支撑点220A-220C处支撑圆盘基板200;以及内径测量部150,该内径测量部150用于根据光接收部120获得的光量的分布来测量圆孔210的内径。版权所有:(C)2009,日本特许厅&INPIT

著录项

  • 公开/公告号JP5004695B2

    专利类型

  • 公开/公告日2012-08-22

    原文格式PDF

  • 申请/专利权人 HOYA株式会社;

    申请/专利号JP20070173584

  • 发明设计人 山口 昇;橘内 浩二;

    申请日2007-06-30

  • 分类号G01B11/12;G11B5/84;

  • 国家 JP

  • 入库时间 2022-08-21 17:40:09

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