首页> 外国专利> GOLD SUPPORT PARTICLE AND METHOD FOR PRODUCING THE SAME, AND CONDUCTIVE FILM PREPARED USING THE GOLD SUPPORT PARTICLE AND METHOD FOR PRODUCING THE CONDUCTIVE FILM

GOLD SUPPORT PARTICLE AND METHOD FOR PRODUCING THE SAME, AND CONDUCTIVE FILM PREPARED USING THE GOLD SUPPORT PARTICLE AND METHOD FOR PRODUCING THE CONDUCTIVE FILM

机译:金支持颗粒和生产相同的方法,以及使用金支持颗粒和生产导电膜的方法

摘要

PROBLEM TO BE SOLVED: To provide a gold support particle including a gold particle monodispersed on a support particle to be supported, and a conductive film prepared using the gold support particle and having excellent conductivity and transparency.SOLUTION: A gold support particle according to the present invention comprises: a support particle; and a gold particle supported on a surface of the support particle. Both of an average primary particle size and an average agglomerated particle size of the gold particle are 1 to 10 nm, a support amount of the gold particle is 1-50% by weight relative to the total weight of the gold support particle, and the support particle comprises an oxide particle.
机译:解决的问题:提供一种金载体颗粒,其包括单分散在要被支撑的载体颗粒上的金颗粒,以及使用该金载体颗粒制备的并且具有优异的导电性和透明性的导电膜。本发明包括:载体颗粒;和在载体颗粒的表面上负载有金颗粒。金粒子的平均一次粒径和平均凝聚粒径均为1〜10nm,金粒子的担载量相对于金载体粒子的总重量为1〜50重量%,且载体颗粒包括氧化物颗粒。

著录项

  • 公开/公告号JP2012048949A

    专利类型

  • 公开/公告日2012-03-08

    原文格式PDF

  • 申请/专利权人 HITACHI MAXELL LTD;

    申请/专利号JP20100189432

  • 发明设计人 SAWAKI HIROKO;KAMINE TOMOKAZU;

    申请日2010-08-26

  • 分类号H01B5;H01B5/16;H01B13;B01J23/66;B01J35/02;H01M4/86;H01M4/90;

  • 国家 JP

  • 入库时间 2022-08-21 17:39:15

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