首页> 外国专利> The Ca content copper alloy target null Ca which is used with membrane manner and this membrane manner of the copper alloy composite membrane which is superior in

The Ca content copper alloy target null Ca which is used with membrane manner and this membrane manner of the copper alloy composite membrane which is superior in

机译:以膜方式使用的Ca含量为目标的零合金Ca,这种膜方式在铜合金复合膜中具有优异的

摘要

PROBLEM TO BE SOLVED: To provide a film deposition method of a copper alloy compound film having excellent adhesiveness.;SOLUTION: Sputtering is executed in the inert gas atmosphere containing 1-20 vol.% oxygen by using a Ca containing copper alloy target having the component composition consisting of 0.06-14 mol% Ca, and the balance Cu with inevitable impurities, and a copper alloy base film containing oxygen-Ca having the component composition containing 0.01-2 mol% Ca and 1-20 mol% oxygen is deposited. Successively, the supply of oxygen is stopped and the sputtering atmosphere is formed to be the inert gas atmosphere. By executing the sputtering in the inert gas atmosphere, a Ca-containing copper alloy conductive film having the component composition containing 0.01-2 mol% Ca and the balance Cu with inevitable impurities is deposited.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种具有优异粘附性的铜合金复合膜的成膜方法。解决方案:通过使用具有以下特征的含Ca的铜合金靶,在含氧量为1-20%(体积)的惰性气体气氛中进行溅射。沉积由0.06-14mol%的Ca和余量的具有不可避免的杂质的Cu组成的组分组成,以及沉积含有氧-Ca的铜合金基膜,该组分具有0.01-2mol%的Ca和1-20mol%的氧。随后,停止氧气的供应,并且将溅射气氛形成为惰性气体气氛。通过在惰性气体气氛中进行溅射,沉积了一种含钙的铜合金导电膜,该膜的成分组成中包含0.01-2 mol%的钙和余量的铜以及不可避免的杂质。COPYRIGHT:(C)2009,JPO&INPIT

著录项

  • 公开/公告号JP4936560B2

    专利类型

  • 公开/公告日2012-05-23

    原文格式PDF

  • 申请/专利权人 三菱マテリアル株式会社;

    申请/专利号JP20080060411

  • 发明设计人 森 曉;

    申请日2008-03-11

  • 分类号C23C14/14;C23C14/34;C23C14/06;H01L21/28;H01L21/285;H01L21/3205;H01L23/532;H01L21/768;

  • 国家 JP

  • 入库时间 2022-08-21 17:38:55

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