首页> 外国专利> Liquid supply manner, the liquid feeder and the substrate grinding device, in the liquid supply manner which

Liquid supply manner, the liquid feeder and the substrate grinding device, in the liquid supply manner which

机译:液体供应方式,液体进给器和基板研磨装置,以液体供应方式

摘要

PROBLEM TO BE SOLVED: To provide a liquid supply method, a liquid supply device, a substrate polisher, and a liquid supply flow measuring method, which prevent granular material such as slurry contained in liquid from adhering to a pipe to be clogged, from applying stress to the supplied liquid, and from causing a change in property of the liquid.;SOLUTION: This liquid supply device for supplying a predetermined flow of polishing liquid from a polishing liquid supply source 103 to the polishing surface of a polishing table 104, includes: supply tubes T1, T2, T3 disposed vertically for storing liquid from the polishing liquid supply source 103; and electropneumatic regulators REG1 to REG3 for supplying pressure gas from a gas source to the supply tubes T1, T2, T3, wherein the polishing liquid filling the supply tubes T1, T2, T3 is supplied to the polishing surface of the polishing table 104 through pipes L2-1, L2-2, L2-3 and a polishing liquid supply pipe L5 without a throttle part for controlling the flow by supplying the pressure gas to the supply tubes T1, T2, T3.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种液体供给方法,液体供给装置,基板抛光机和液体供给流量测量方法,以防止施加诸如液体中包含的浆料之类的颗粒状材料粘附至待堵塞的管道。解决方案:该液体供应装置用于从抛光液体供应源103向抛光台104的抛光表面供应预定流量的抛光液体。供给管T1,T2,T3垂直放置,用于储存来自抛光液供给源103的液体。电动气压调节器REG1至REG3,用于从气体源向供应管T1,T2,T3供应压力气体,其中,将填充有供应管T1,T2,T3的抛光液通过管道供应至抛光台104的抛光表面。 L2-1,L2-2,L2-3和没有节流阀部件的抛光液供应管L5,用于通过将压力气体供应到供应管T1,T2,T3来控制流量。;版权所有:(C)2007,JPO&INPIT

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