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The element splitting the reliability evaluation device of metal wiring and record media null bamboo wiring which stores the program for reliability evaluation

机译:将金属配线的可靠性评价装置和记录介质为空的竹配线的分割要素分开,该要素存储用于可靠性评价的程序

摘要

PROBLEM TO BE SOLVED: To predict void formation and disconnection failure by a numerical simulation using electromigration (EM) damage control parameters of metal wiring.;SOLUTION: In the numerical simulation, the metal wiring is divided into elements. The distributions of current density and temperature are obtained by numerical analysis (S304). Atomic flux divergence AFDgen of respective elements is calculated, by using the distributions and physical property constants (S306) of materials predetermined by accelerated tests (S308). The volume reduction per one calculation step (S312) in the simulation is given, by multiplying by the volume of each element the time corresponding to a single calculation step, and the atomic volume corresponding to calculated AFDgen (S310). The thickness of each element is decreased based on the decrease in volume (S314). For an element, of which the thickness is decreased, it is indicated that voids have been formed. Numerical analysis on the distributions of current density and temperature in the metal wiring is performed again, taking into consideration the thickness of each element (S304). Calculations are performed repeatedly.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:通过使用金属布线的电迁移(EM)损伤控制参数的数值模拟来预测空隙形成和断开故障。;解决方案:在数值模拟中,金属布线被分为元素。通过数值分析获得电流密度和温度的分布(S304)。通过使用由加速试验(S308)预定的材料的分布和物理性质常数(S306)来计算各个元素的原子通量散度AFDgen。通过将每个元素的体积乘以对应于单个计算步骤的时间以及对应于所计算的AFDgen的原子体积,来给出仿真中每一个计算步骤的体积减少量(S312)。基于体积的减小来减小每个元件的厚度(S314)。对于厚度减小的元件,表明已经形成了空隙。考虑到每个元件的厚度,再次对金属布线中的电流密度和温度的分布进行数值分析(S304)。反复进行计算。版权所有:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP4889040B2

    专利类型

  • 公开/公告日2012-02-29

    原文格式PDF

  • 申请/专利权人 独立行政法人科学技術振興機構;

    申请/专利号JP20070246243

  • 发明设计人 笹川 和彦;

    申请日2007-09-21

  • 分类号H01L21/3205;H01L23/52;

  • 国家 JP

  • 入库时间 2022-08-21 17:36:00

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