Scalable electronics, computer, router, process control and other module/enclosures employing approximated tesselation(s)/tiling(s) or electronics and other modules from tow modules to columns, rows and arrays with optional deployment utilizing palletization for build out of existing industrial space and/or new construction with nestable wiring applicable from module and assembly level to molecular and atomic levels

摘要

Scalable Electronics, Computer, Router, Process Control and other Module/Enclosures Employing Approximated Tessellation/Tiling or Electronics and Other Modules from Two Modules to Columns, Rows and Arrays with Optional Deployment utilizing Palletization for Build out of Existing Industrial Space And/or New Construction with nestable wiring applicable from module and assembly and chip level to molecular and atomic levels.