首页> 外国专利> COOLING SOLID STATE HIGH-BRIGHTNESS WHITE-LIGHT ILLUMINATION SOURCES

COOLING SOLID STATE HIGH-BRIGHTNESS WHITE-LIGHT ILLUMINATION SOURCES

机译:冷却固态高亮度白光照明光源

摘要

In one general aspect, an illumination source is disclosed that comprises a housing, which can be made of a non-conducting material, and includes a cooling air intake port and a cooling air exhaust port. A circuit board is supported with respect to the housing and includes at least one insulating layer, and at least a first, electrically conductive layer on a first side of the insulating layer, with the first layer defining a plurality of pads and a plurality of traces interconnecting at least some of the pads. A socket is supported with respect to the housing and has a pair of connector surfaces for receiving power, and has an axis of insertion. A plurality of LED chips are each electrically connected to a plurality of the pads and each have an axis of illumination that is at least generally aligned with the axis of insertion. A fan is positioned between the socket and the circuit board and has an air flow delivery sufficient to provide for the majority of the cooling of the LED chips to within a predetermined operating temperature to take place through surfaces of the board. Baffles can redirect the cooling air flow.
机译:在一个总体方面,公开了一种照明源,该照明源包括壳体,该壳体可以由非导电材料制成,并且包括冷却空气进气口和冷却空气排气口。相对于壳体支撑电路板,该电路板包括至少一个绝缘层和在该绝缘层的第一侧上的至少第一导电层,其中该第一层限定了多个焊盘和多个迹线。互连至少一些焊盘。插座相对于壳体被支撑,并且具有用于接收电力的一对连接器表面,并且具有插入轴线。多个LED芯片分别电连接到多个焊盘,并且每个LED芯片具有至少与插入轴线大致对准的照明轴线。风扇位于插座和电路板之间,并具有足以使大部分LED芯片冷却至预定工作温度以通过板表面进行的气流传递。挡板可以改变冷却气流的方向。

著录项

  • 公开/公告号US2012212960A1

    专利类型

  • 公开/公告日2012-08-23

    原文格式PDF

  • 申请/专利权人 EDWARD T. RODRIGUEZ;

    申请/专利号US201013382879

  • 发明设计人 EDWARD T. RODRIGUEZ;

    申请日2010-07-06

  • 分类号F21V29/02;

  • 国家 US

  • 入库时间 2022-08-21 17:33:52

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