首页> 外国专利> CLOSED LOOP DYNAMIC INTERCONNECT BUS ALLOCATION METHOD AND ARCHITECTURE FOR A MULTI LAYER SoC

CLOSED LOOP DYNAMIC INTERCONNECT BUS ALLOCATION METHOD AND ARCHITECTURE FOR A MULTI LAYER SoC

机译:多层SoC的闭环动态互连总线分配方法和体系结构

摘要

A closed loop dynamic interconnect bus allocation method and architecture for a multi layer SoC is disclosed. In one embodiment, a system on chip (SoC) includes multiple masters, multiple slaves, multiple buses, and an interconnect module coupled to multiple masters and multiple slaves via multiple buses. The interconnect module includes an arbiter. The SoC also includes an inner characteristic bus coupled to the plurality of masters, the plurality of slaves and the interconnect module. The interconnect module receives on-chip bus transactions substantially simultaneously from the multiple masters to be processed on one or more of the multiple slaves via the multiple buses. The interconnect module also receives inner characteristic information of the on-chip bus transactions via the inner characteristic bus. Further, the interconnect module allocates the received on-chip bus transactions from the multiple masters to associated one or more of multiple slaves based on the received inner characteristic information.
机译:公开了一种用于多层SoC的闭环动态互连总线分配方法和架构。在一个实施例中,片上系统(SoC)包括多个主机,多个从机,多个总线以及经由多个总线耦合到多个主机和多个从机的互连模块。互连模块包括仲裁器。 SoC还包括内部特性总线,该内部特性总线耦合到多个主机,多个从机和互连模块。互连模块基本上同时从多个主机接收片上总线事务,以经由多个总线在多个从机中的一个或多个从机上进行处理。互连模块还通过内部特性总线接收片上总线事务的内部特性信息。此外,互连模块基于接收到的内部特性信息,将接收到的来自多个主机的片上总线事务分配给多个从机中的一个或多个相关联。

著录项

  • 公开/公告号US2012124260A1

    专利类型

  • 公开/公告日2012-05-17

    原文格式PDF

  • 申请/专利权人 SRINIVASA RAO KOTHAMASU;

    申请/专利号US20100944762

  • 发明设计人 SRINIVASA RAO KOTHAMASU;

    申请日2010-11-12

  • 分类号G06F13/00;

  • 国家 US

  • 入库时间 2022-08-21 17:33:42

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