Heat sink and cooling method for LED lighting and other applications

摘要

An inventive heat sink adapted for use with light emitting diode luminaires and other applications comprising: a first layer of carbon graphite in thermal communication with a source of heat and a second layer of aluminum in thermal communication with said first layer. Also disclosed is an inventive troffer including a frame; a printed circuit board mounted within the frame; an array of light emitting diodes mounted on the printed circuit board; a heat sink mounted in parallel with the printed circuit board; and a thermal interface layer disposed between the heat sink and the printed circuit board. In yet another embodiment, the inventive troffer assembly includes plural modules mounted within the frame, each module including: a printed circuit board mounted within the frame; an array of light emitting diodes mounted on the printed circuit board; a heat sink mounted in parallel with the printed circuit board; and a thermal interface layer disposed between the heat sink and the printed circuit board.