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PARTITIONED ARRAY EJECTION CHIPS FOR MICRO-FLUID APPLICATIONS
PARTITIONED ARRAY EJECTION CHIPS FOR MICRO-FLUID APPLICATIONS
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机译:适用于微流体应用的分区阵列弹出芯片
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摘要
A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged adjacently along corresponding ones of fluid vias skewed variously or not to enable seamless stitching of printed images from the adjacent firing elements. The firing elements are energized to eject fluid and individual ones are spaced according to colors or fluid types. Overlapping firing elements serve redundancy efforts during imaging for reliable print quality. Variable chips sizes and shapes, including chevrons, are disclosed as are relationships between differently colored fluid vias. Skew angles range variously each with noted advantages. Bond pads and overlying encapsulation materials are still other features as are metallization lines for distributing power to ones of firing elements. Singulating chips from larger wafers provide still further embodiments as does increased usage of the wafer.
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