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Intra-cavity frequency doubled microchip laser operating in TEM00 transverse mode

机译:以TEM 00 横向模式工作的腔内倍频微芯片激光器

摘要

A method for making a microchip laser includes preparing a laser-cavity chip assembly comprising a gain media, a first substantially flat surface, and a second substantially flat surface parallel to the first substantially flat surface. The method also includes forming a first reflective film on the first substantially flat surface to form a first cavity mirror, forming a second reflective film on the second substantially flat surface to form a second cavity mirror, and patterning at least one of the first reflective film or the second reflective film by removing at least a portion of the reflective film in the outer portion to form a center reflective portion in the one of the first reflective film or the second reflective film. The first cavity mirror and the second cavity mirror can suppress higher order transverse modes and produce a single TEM00 mode in the lasing light.
机译:一种用于制造微芯片激光器的方法,包括制备激光腔芯片组件,该组件包括增益介质,第一基本平坦的表面和与第一基本平坦的表面平行的第二基本平坦的表面。该方法还包括在第一基本平坦的表面上形成第一反射膜以形成第一腔镜,在第二基本平坦的表面上形成第二反射膜以形成第二腔镜,以及图案化第一反射膜中的至少一个或者通过去除外部的至少一部分反射膜以在第一反射膜或第二反射膜中的一个中形成中心反射部分来形成第二反射膜。第一腔镜和第二腔镜可以抑制高阶横向模,并在激光中产生单个TEM 00 模。

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