mechanical temperaturkompenseringselement, procedure for assembly thereof, and process for mechanical temperaturkompensera

摘要

The invention pertains to a device and a method for compensating for heat expansion effects in solid materials, and a method for manufacturing the device. The temperature compensation is performed by the device through mechanically working together with the device for which the temperature is to be compensated. The temperature compensation element comprising an enclosed disc (10), which via an inclined link device (13) is connected to a housing (11) whose heat expansion coefficient is different compared to the enclosed disc. Compensation for both negative and positive temperatures can be conducted. The manufacturing method comprising heating up or cooling down the components, achieving a pressure fit when the parts have been assembled and the temperature of the components has been controlled to the intended temperature compensation range.