A temperature measuring unit of a temperature sensor has electrodes disposed on the upper and lower surfaces of a temperature measuring element, thin-film substrates disposed on the upper and lower surfaces of the electrodes, and laser beam shield plates disposed on the upper and lower surfaces of the thin-film substrates. One of the electrodes is bonded to the temperature measuring element by a conductive adhesive, and the other electrode is not bonded to the temperature measuring element by a conductive adhesive. When the temperature sensor is bonded to a hollow cylinder of an insert, the temperature measuring unit is curved along the surface of the hollow cylinder, tending to develop tensile stresses in the other electrode. At this time, the other electrode is positionally displaced depending on the developed tensile stresses, allowing the temperature sensor to be adjusted in length. Consequently, the temperature sensor is prevented from being broken or damaged.
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