SOLDER LAYER, HEAT SINK USING SUCH SOLDER LAYER AND METHOD FOR MANUFACTURING SUCH HEAT SINK

摘要

A heat sink (10) is disclosed which comprises a substrate (1), an electrode layer (2) formed on the substrate (1) and a solder layer (3) formed on the substrate (1) wherein the solder layer (3) provides a bonding strength of not less than 30 MPa and a shear strain of not less than 0.07. The hear sink may be a sub-mount which comprises a sub-mount substrate (1), an electrode layer (2) formed on the substrate (1) and a solder layer (3) formed on the substrate (1) wherein the electrode layer (2) is formed with a window portion (2A) having the solder layer (3) embedded therein and is connected to an outer peripheral area of the solder layer (3). A sub-mount that has a high strength of bonding between the solder layer (3) and a semiconductor device is provided at a reduced cost.