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ULTRASONIC WAVE PROBE FOR DRAWING OUT A SIGNAL FROM A WHOLE VIBRATOR CAPABLE OF EASILY BEING TREATED IN AN ULTRASONIC PROBE AT LOW COSTS AND A METHOD FOR MANUFACTURING AN ULTRASONIC WAVE PROBE
ULTRASONIC WAVE PROBE FOR DRAWING OUT A SIGNAL FROM A WHOLE VIBRATOR CAPABLE OF EASILY BEING TREATED IN AN ULTRASONIC PROBE AT LOW COSTS AND A METHOD FOR MANUFACTURING AN ULTRASONIC WAVE PROBE
PURPOSE: An ultrasonic wave probe and a method for manufacturing an ultrasonic wave probe are provided to process a part of ultrasonic wave sending and receiving in a whole vibrator using a plurality of ICs.;CONSTITUTION: A first sound matching layer(7) is bonded to the front side of a piezoelectric layer. A second sound matching layer(9) is bonded to the front side of the first sound matching layer. An intermediate layer(13) is bonded to the rear side of the piezoelectric layer. The second sound matching layer, the first sound matching layer, the piezoelectric layer, and an intermediate layer are respectively partitioned into a lattice shape on a XY plane. The piezoelectric layer is composed of a plurality of piezoelectric elements(51) which is partitioned into the lattice shape on the XY plane. The first sound matching layer is composed of a plurality of first acoustic matching elements(71) which is partitioned into the lattice shape on the XY plane. The second sound matching layer is composed of a plurality of second acoustic matching elements(91) which is partitioned into the lattice shape on the XY plane. The intermediate layer is composed of a plurality of middle elements(131) which is partitioned into the lattice shape on the XY plane.;COPYRIGHT KIPO 2012
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