首页> 外国专利> ETCHANT COMPOSITION FOR A METAL LAYER WITH COPPER AND TITANIUM CAPABLE OF EMBODYING RAPID ETCHING RATE AND EXCELLENT ETCING PERFORMANCE

ETCHANT COMPOSITION FOR A METAL LAYER WITH COPPER AND TITANIUM CAPABLE OF EMBODYING RAPID ETCHING RATE AND EXCELLENT ETCING PERFORMANCE

机译:具有铜和钛能力的金属层的粘合剂组成,具有快速的刻蚀速率和出色的刻蚀性能

摘要

PURPOSE: An etchant composition is provided to embody rapid etching rate, to have excellent etching performance, and to keep etchant for long time without containing hydrogen peroxide and/or oxone.;CONSTITUTION: An etchant composition for a metal layer with copper and titanium comprises persulfate, a fluorine-containing compound, inorganic acid, a cyclic amine compound, copper salts, p-toluenesulfonic acid, and water. The cyclic amine compound is at least one selected from a group consisting of aminotetrazole, tolytriazoles, benzotriazoles, methylbenzotriazoles, and imidazoles. The copper salt is at least one selected from the group consisting of cupric chloride, copper sulphate, and copper nitrate. The metal layer with copper and titanium is a multilayer comprising a copper based metal layer and a titanium based metal layer.;COPYRIGHT KIPO 2012
机译:目的:提供一种刻蚀剂组合物,以体现出快速的刻蚀速率,具有优异的刻蚀性能,并在不包含过氧化氢和/或丙酮的情况下长时间保持刻蚀剂。组成:用于铜和钛金属层的刻蚀剂组合物包括过硫酸盐,含氟化合物,无机酸,环胺化合物,铜盐,对甲苯磺酸和水。环胺化合物是选自氨基四唑,甲苯基三唑,苯并三唑,甲基苯并三唑和咪唑中的至少一种。铜盐是选自氯化铜,硫酸铜和硝酸铜中的至少一种。具有铜和钛的金属层是包括铜基金属层和钛基金属层的多层。; COPYRIGHT KIPO 2012

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