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ETCHANT COMPOSITION FOR A METAL LAYER WITH COPPER AND TITANIUM CAPABLE OF EMBODYING RAPID ETCHING RATE AND EXCELLENT ETCING PERFORMANCE
ETCHANT COMPOSITION FOR A METAL LAYER WITH COPPER AND TITANIUM CAPABLE OF EMBODYING RAPID ETCHING RATE AND EXCELLENT ETCING PERFORMANCE
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机译:具有铜和钛能力的金属层的粘合剂组成,具有快速的刻蚀速率和出色的刻蚀性能
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摘要
PURPOSE: An etchant composition is provided to embody rapid etching rate, to have excellent etching performance, and to keep etchant for long time without containing hydrogen peroxide and/or oxone.;CONSTITUTION: An etchant composition for a metal layer with copper and titanium comprises persulfate, a fluorine-containing compound, inorganic acid, a cyclic amine compound, copper salts, p-toluenesulfonic acid, and water. The cyclic amine compound is at least one selected from a group consisting of aminotetrazole, tolytriazoles, benzotriazoles, methylbenzotriazoles, and imidazoles. The copper salt is at least one selected from the group consisting of cupric chloride, copper sulphate, and copper nitrate. The metal layer with copper and titanium is a multilayer comprising a copper based metal layer and a titanium based metal layer.;COPYRIGHT KIPO 2012
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