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POLYORGANOSILOXANE COMPOSITION HAVING IMPROVED UNIFORM RESISTANCE, AND AN ELECTRONIC DEVICE INCLUDING A SEALING MATERIAL FORMED BY THE POLYORGANOSILOXANE COMPOSITION
POLYORGANOSILOXANE COMPOSITION HAVING IMPROVED UNIFORM RESISTANCE, AND AN ELECTRONIC DEVICE INCLUDING A SEALING MATERIAL FORMED BY THE POLYORGANOSILOXANE COMPOSITION
PURPOSE: A polyorganosiloxane composition is provided to improve crack resistance with maintaining heat resistance and light resistance, and to secure the stability of an emitting diode, thereby improving productivity.;CONSTITUTION: A polyorganosiloxane composition comprises a first portion in chemical formula 1, a second portion in chemical formula 2, a linear first polyorganosiloxane resin, which has double bonds in both ends, and a network second polyorganosiloxane resin. The number average molecular weight of the first polyorganosiloxane resin is 900-20000. The amount of the first polyorganosiloxane resin and the second polyorganosiloxane resin is 10-25 parts by weight and 40-75 parts by weight respectively.;COPYRIGHT KIPO 2012
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