RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE RADIATING SUBSTRATE, AND LUMINOUS ELEMENT PACKAGE WITH THE RADIATING STRUCTURE

摘要

PURPOSE: A heat dissipation substrate, a manufacturing method thereof, and a light emitting device package including the same are provided to significantly improve heat dissipation efficiency by forming graphene on the heat dissipation substrate which has excellent heat conductivity compared to a metal. CONSTITUTION: A light emitting device(110) is a light emitting diode or/and a laser diode. A heat dissipation substrate(120) releases heat generated from the light emitting device to the outside. The heat dissipation substrate includes a structure in which a plurality of build-up insulating films(122) is laminated. The insulating film includes a polymer resin and graphene. The light emitting device is electrically connected to an inner layer circuit patter(124) by being welded to an outer layer circuit pattern(126).