首页> 外国专利> WATER SOLUBLE CUTTING OIL FOR CUTTING WAFERS, AND A WATER SOLUBLE CUTTING LIQUID COMPOSITION CONTAINING THE SAME

WATER SOLUBLE CUTTING OIL FOR CUTTING WAFERS, AND A WATER SOLUBLE CUTTING LIQUID COMPOSITION CONTAINING THE SAME

机译:用于切削晶片的水溶性切削油以及包含该水溶性切削油的液体组合物

摘要

PURPOSE: A water soluble cutting oil for cutting wafers, and a water soluble cutting liquid composition containing the same are provided to improve a work environment by providing safety to humans.;CONSTITUTION: A water soluble cutting oil is shown in chemical formula 1. In the chemical formula 1, R1 and R2 are independently hydrogen or alkyl with 1-24 carbons. A water soluble cutting liquid composition contains 30-100wt% of the water soluble cutting oil. The water soluble cutting liquid composition additionally contains a water soluble polymer, glycerol, alkylene glycol, an alkylene oxide byproduct, or water.;COPYRIGHT KIPO 2012
机译:目的:提供一种用于切割晶片的水溶性切削油和一种包含该切削油的水溶性切削液组合物,以通过为人类提供安全来改善工作环境。;组成:水溶性切削油的化学式1所示。化学式1,R 1和R 2独立地是氢或具有1-24个碳的烷基。水溶性切削液组合物包含30-100wt%的水溶性切削油。水溶性切削液组合物还包含水溶性聚合物,甘油,亚烷基二醇,环氧烷烃副产物或水。; COPYRIGHT KIPO 2012

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