首页> 外国专利> THERMOPLASTIC RESIN COMPOSITION AND A RESIN MOLDING CAPABLE OF IMPROVING LOW-TEMPERATURE STRESS BLOOMING RESISTANCE AND SCRATCH RESISTANCE WITHOUT USING POLYORGANOSILOXANE

THERMOPLASTIC RESIN COMPOSITION AND A RESIN MOLDING CAPABLE OF IMPROVING LOW-TEMPERATURE STRESS BLOOMING RESISTANCE AND SCRATCH RESISTANCE WITHOUT USING POLYORGANOSILOXANE

机译:在不使用聚有机硅氧烷的情况下,可改善低温应力的耐起霜性和耐刮擦性的热塑树脂组成和树脂成型能力

摘要

PURPOSE: A thermoplastic resin composition and a resin molding are provided to improve scratch resistance, surface hardness, mechanical property, and especially low temperature internal stress blooming resistance.;CONSTITUTION: A thermoplastic resin composition comprises 100.0 parts by weight of base resin and 0.01-5 parts by weight of (C1-10 alkyl)acrylate based polymer. The base resin comprises 70-90 parts by weight of polymerized acrylic resin and 10-30 parts by weight of graft copolymer. The graft-copolymer is a polymer of conjugated diene-based rubber polymer, vinyl cyanide compound, and aromatic vinyl compound. The Acrylic resin is a polymer of ester-based compound, vinyl cyanide compound, and vinyl aromatic compounds. The ester based compound is one or more of (C1-6 alkyl)acrylate, (C1-6 alkyl)methacrylate, and (C1-6 alkyl)ethacrylate.;COPYRIGHT KIPO 2012
机译:目的:提供热塑性树脂组合物和树脂模制品,以改善耐划伤性,表面硬度,机械性能,尤其是低温内应力起霜性。;组成:热塑性树脂组合物包含100.0重量份的基础树脂和0.01- 5重量份的(C 1-10烷基)丙烯酸酯基聚合物。基础树脂包含70-90重量份的聚合丙烯酸树脂和10-30重量份的接枝共聚物。接枝共聚物是基于共轭二烯的橡胶聚合物,乙烯基氰化合物和芳族乙烯基化合物的聚合物。丙烯酸树脂是酯基化合物,乙烯基氰化物和乙烯基芳族化合物的聚合物。酯基化合物是(C1-6烷基)丙烯酸酯,(C1-6烷基)甲基丙烯酸酯和(C1-6烷基)乙基丙烯酸酯中的一种或多种。; COPYRIGHT KIPO 2012

著录项

  • 公开/公告号KR20120070119A

    专利类型

  • 公开/公告日2012-06-29

    原文格式PDF

  • 申请/专利权人 LG CHEM. LTD.;

    申请/专利号KR20100131545

  • 申请日2010-12-21

  • 分类号C08L33/04;C08L55/02;C08F20/10;C08F279/04;

  • 国家 KR

  • 入库时间 2022-08-21 17:09:41

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