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THERMOPLASTIC RESIN COMPOSITION AND A RESIN MOLDING CAPABLE OF IMPROVING LOW-TEMPERATURE STRESS BLOOMING RESISTANCE AND SCRATCH RESISTANCE WITHOUT USING POLYORGANOSILOXANE
THERMOPLASTIC RESIN COMPOSITION AND A RESIN MOLDING CAPABLE OF IMPROVING LOW-TEMPERATURE STRESS BLOOMING RESISTANCE AND SCRATCH RESISTANCE WITHOUT USING POLYORGANOSILOXANE
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机译:在不使用聚有机硅氧烷的情况下,可改善低温应力的耐起霜性和耐刮擦性的热塑树脂组成和树脂成型能力
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PURPOSE: A thermoplastic resin composition and a resin molding are provided to improve scratch resistance, surface hardness, mechanical property, and especially low temperature internal stress blooming resistance.;CONSTITUTION: A thermoplastic resin composition comprises 100.0 parts by weight of base resin and 0.01-5 parts by weight of (C1-10 alkyl)acrylate based polymer. The base resin comprises 70-90 parts by weight of polymerized acrylic resin and 10-30 parts by weight of graft copolymer. The graft-copolymer is a polymer of conjugated diene-based rubber polymer, vinyl cyanide compound, and aromatic vinyl compound. The Acrylic resin is a polymer of ester-based compound, vinyl cyanide compound, and vinyl aromatic compounds. The ester based compound is one or more of (C1-6 alkyl)acrylate, (C1-6 alkyl)methacrylate, and (C1-6 alkyl)ethacrylate.;COPYRIGHT KIPO 2012
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