首页> 外国专利> METHODD OF COATING PHOSPHOR LAYER ON THE LED CHIP CAPABLE OF UNIFORMLY COATING A PHOSPHOR LAYER ON THE FRONT AND SIDE OF A LIGHT EMITTING CHIP

METHODD OF COATING PHOSPHOR LAYER ON THE LED CHIP CAPABLE OF UNIFORMLY COATING A PHOSPHOR LAYER ON THE FRONT AND SIDE OF A LIGHT EMITTING CHIP

机译:能够在发光芯片的前部和侧面均匀地涂覆磷光层的LED芯片上涂覆磷光层的方法

摘要

PURPOSE: A method of coating phosphor layer on the LED chip is provided to increase uniformity and productivity by coating with phosphor after forming constant intervals between light emitting chips in advance.;CONSTITUTION: A plurality of light emitting chips(150) are arranged on an extensible film(110). Intervals between the plurality of light emitting chips transferred onto a thermal resistant film(120) are formed by expanding the extensible film. A phosphor material is coated on the top and side of the plurality of light emitting chips. The extensible film is composed of a polyolefin material.;COPYRIGHT KIPO 2012
机译:目的:提供一种在LED芯片上涂覆磷光体层的方法,以在预先在发光芯片之间形成恒定间隔之后通过涂覆磷光体来提高均匀性和生产率。组成:多个发光芯片(150)布置在一个发光芯片上。可延展薄膜(110)。通过使可延伸膜膨胀来形成转移到耐热膜(120)上的多个发光芯片之间的间隔。磷光体材料涂覆在多个发光芯片的顶部和侧面上。可延展膜由聚烯烃材料组成。; COPYRIGHT KIPO 2012

著录项

  • 公开/公告号KR20120083714A

    专利类型

  • 公开/公告日2012-07-26

    原文格式PDF

  • 申请/专利权人 SAMSUNG LED CO. LTD.;

    申请/专利号KR20110005010

  • 发明设计人 YOO CHEOL JUN;KIM MIN JUNG;CHOI ILL HEUNG;

    申请日2011-01-18

  • 分类号H01L33/50;

  • 国家 KR

  • 入库时间 2022-08-21 17:09:28

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