RESIN COMPOSITION FOR ACCEPTING A PACKAGE FOR AN OPTICAL SEMICONDUCTOR DEVICE CAPABLE OF IMPARTING LIGHT REFLECTIVITY HAVING EXCELLENT LONG TERM-HEAT RESISTANCE, AND AN OPTICAL SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE SAME

摘要

PURPOSE: A resin composition is provided to have excellent soldering-heat resistance and long term-heat resistance, and good optical reflectivity, thereby capable of providing an optical semiconductor light emitting device with excellent producibility and effectiveness.;CONSTITUTION: A resin composition for accepting a package for an optical semiconductor device comprises (A) an epoxy resin, (B) an acid anhydride vulcanizer, (C) white pigment, and (D) inorganic filler. The blending rate((C)/(D)) of the component (C) and (D) is 0.26-3.0. An optical semiconductor light emitting device comprises an insulating resin layer(3), a concave part formed on the insulating resin layer, a metal lead frame(1) arranged in the concave part, and photosemiconductor element(2) arranged on the metal lead frame. The insulating resin layer is formed of the resin composition.;COPYRIGHT KIPO 2013