CONDUCTIVE RESIN COMPOSITION CAPABLE OF PROVIDING A CURED MATERIAL HAVING EXCELLENT ADHESION TO A SUBSTRATE, HIGH CONDUCTIVITY, EXCELLENT SOLDERING HEAT RESISTANCE, AND EXCELLENT TAPE PEELING RESISTANCE

摘要

PURPOSE: A conductive resin composition is provided to obtain a cured material with excellent soldering heat resistance and abrasion resistance even in case residual phenol or residual formaldehyde in a resol type phenol resin is reduced.;CONSTITUTION: A conductive resin composition comprises a resol type phenol resin, a pyrazole compound, an isocyanate compound, a conductive powder, and a siloxane compound containing a hydroxy group. The pyrazole compound is 3,5-dimethylpyrazole. The isocyanate compound is a blocked isocyanate compound. The conductive resin composition comprises the resol type phenol resin, pyrazole-blocked isocyanate compound, conductive powder and hydroxy group-containing siloxane compound.;COPYRIGHT KIPO 2013;[Reference numerals] (AA) Change rate of resistance(%); (BB) Rate of addition(%); (CC) Relation between the rate of addition and the change rate of resistance after soldering