VACUUM PROCESSING APPARATUS AND A VACUUM PROCESSING METHOD CAPABLE OF COOLING A WAFER BY SPRAYING INSERT GASES

摘要

PURPOSE: A vacuum processing apparatus and a vacuum processing method are provided to prevent and suppress foreign materials due to the misalignment of a wafer by rapidly cooling the wafer of a high temperature.;CONSTITUTION: A cooling chamber(1) includes a vacuum container(2) made of aluminum. A sleeve(3) of quartz is installed in the vacuum container. Cooling gas is introduced from a gas supply hole(4) on the upper side of the cooling chamber. A wafer(7) is supported by three pushers(10). A supporter(11) is connected to a motor(15) which arbitrarily changes a lifting speed.;COPYRIGHT KIPO 2013;[Reference numerals] (1-1) Figure of a vacuum processing device; (1-2) Profile of a cooling chamber