首页> 外国专利> NON-CONTACT TYPE DEVICE FOR MEASURING THE TEMPERATURE OF INFRARED RAYS, CAPABLE OF MEASURING THE TEMPERATURE OF A MEASUREMENT OBJECT BY DETECTING A WAVELENGTH RANGE OF INFRARED RAYS RADIATED FROM THE MEASUREMENT OBJECT

NON-CONTACT TYPE DEVICE FOR MEASURING THE TEMPERATURE OF INFRARED RAYS, CAPABLE OF MEASURING THE TEMPERATURE OF A MEASUREMENT OBJECT BY DETECTING A WAVELENGTH RANGE OF INFRARED RAYS RADIATED FROM THE MEASUREMENT OBJECT

机译:用于测量红外射线温度的非接触式设备,能够通过检测从测量对象辐射的波长范围来测量测量对象的温度

摘要

PURPOSE: A non-contact type device for measuring the temperature of infrared rays is provided to reduce distorted infrared rays from being transmitted to an infrared sensor unit by minimizing an intake of the infrared rays because the infrared rays crashing to an inner wall of a light receiving body is reflected by a concavo-convex portion by forming into a surface of the inner wall of the light receiving body into the concavo-convex portion.;CONSTITUTION: A non-contact type device for measuring the temperature of infrared rays comprises a casing(10), a light receiving body(20), an infrared sensor(30), and a PCB substrate(40). The light receiving body is installed in the inside of the casing and comprises a light receiving unit(21) and concavo-convex unit(21a). The light receiving unit receives infrared rays being radiated from a measurement object. The concavo-convex unit is formed in an inner periphery of the light receiving unit into a screw-thread form. The infrared sensor is installed in a hole(22) formed in a bottom surface of the light receiving unit, thereby sensing the infrared ray wavelength received by the light receiving unit. The infrared ray sensor converts the sensed infrared ray wavelength into voltage. The PCB substrate is electrically connected to the infrared sensor. The controlling unit is mounted on the PCB substrate. The controlling unit calculates the temperature of the measurement object by comparing the converted voltage and reference voltage.;COPYRIGHT KIPO 2013
机译:用途:提供一种用于测量红外线温度的非接触型设备,以通过使红外线入射到光的内壁而使红外线的吸收最小化,来减少变形的红外线传输至红外线传感器单元。通过在光接收体的内壁的表面上形成凹凸部分,使凹凸部分反射接收体。组成:一种用于测量红外线温度的非接触型装置,包括壳体(10),受光体(20),红外传感器(30)和PCB基板(40)。受光体安装在壳体的内部,并且包括受光单元(21)和凹凸单元(21a)。受光部接收从被测定物放射的红外线。凹凸单元在光接收单元的内周中形成为螺纹形式。红外传感器安装在形成在光接收单元的底表面中的孔(22)中,从而感测由光接收单元接收的红外线波长。红外线传感器将感测到的红外线波长转换为电压。 PCB基板电连接到红外传感器。控制单元安装在PCB基板上。控制单元通过比较转换后的电压和参考电压来计算测量对象的温度。; COPYRIGHT KIPO 2013

著录项

  • 公开/公告号KR20120121128A

    专利类型

  • 公开/公告日2012-11-05

    原文格式PDF

  • 申请/专利权人 GASDNA CO. LTD.;

    申请/专利号KR20110038913

  • 发明设计人 GO SUNG WOON;

    申请日2011-04-26

  • 分类号G01J5/10;

  • 国家 KR

  • 入库时间 2022-08-21 17:08:49

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