首页> 外国专利> ORGANOPOLYSILOXANE SOLUBLE TO NON-POLAR ORGANIC SOLVENT WHILE HAVING EXCELLENT ADHESION AND HEAT RESISTANCE, A PRE-ADHESIVE COMPOSITION USING THE SAME, AND A MANUFACTURING METHOD OF A THIN-FILM WAFER USING THE COMPOSITION

ORGANOPOLYSILOXANE SOLUBLE TO NON-POLAR ORGANIC SOLVENT WHILE HAVING EXCELLENT ADHESION AND HEAT RESISTANCE, A PRE-ADHESIVE COMPOSITION USING THE SAME, AND A MANUFACTURING METHOD OF A THIN-FILM WAFER USING THE COMPOSITION

机译:有机硅氧烷可溶解于非极性有机溶剂中,具有优异的附着力和耐热性,使用相同的预胶粘剂,以及使用该胶粘剂制备薄膜硅片的方法

摘要

PURPOSE: Organopolysiloxane and a pre-adhesive composition are soluble into a non-polar organic solvent, and to be separated in short time, and to be hardly soluble into a polar solvent, and to be not separated when spreading or removing photoresist on a semiconductor of a conjugation substrate.;CONSTITUTION: A non-aromatic saturated hydrocarbon group-containing organopolysiloxane comprises: 40-99 mol% of a siloxane unit(T unit) represented by R^1SiO_3/2; 59 mol% or less of a siloxane unit(D unit) represented by R^2R^3SiO_2/2; and 1-30 mol% of a siloxane unit(M unit) represented by R^4R^5R^6SiO_1/2. In the chemical formula, R^1-R^6 is a monovalent organic group or hydrogen. A pre-adhesive composition comprises the organopolysiloxane and an organic solvent.;COPYRIGHT KIPO 2013
机译:用途:有机聚硅氧烷和预粘合剂组合物可溶于非极性有机溶剂中,并在短时间内分离,几乎不溶于极性溶剂,并且在半导体上散布或去除光刻胶时不分离组成:非芳香族的含饱和烃基的有机基聚硅氧烷包含:40-99mol%的由R ^ 1SiO_3 / 2表示的硅氧烷单元(T单元);和59摩尔%以下的R ^ 2R ^ 3SiO_2 / 2所表示的硅氧烷单元(D单元); 1〜30摩尔%的R ^ 4R ^ 5R ^ 6SiO_1 / 2表示的硅氧烷单元(M单元)。在化学式中,R ^ 1-R ^ 6是一价有机基团或氢。预粘合剂组合物包含有机聚硅氧烷和有机溶剂。; COPYRIGHT KIPO 2013

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