Interfacial delaminating apparatus by introducing a substrate through-thickness crack

摘要

PURPOSE: An interfacial debonding device through the inducement of substrate cracks is provided to handles a whole thin film including a substrate, thereby stably inducing an interfacial debonding. CONSTITUTION: An interfacial debonding device(100) through the inducement of substrate cracks comprises a fixing unit(110) and a moving unit(120). The fixing unit comprises a load cell(111). The moving unit comprises a displacement measuring member(121). One side of a cracked substrate(520) is horizontally fixed to the fixing unit after forming cracks on the substrate. The other side of the cracked substrate is horizontally fixed to the moving unit. An interface bonding force between a thing film(510) and the substrate is measure by using a vertical transferring displacement value measured by the displacement measuring member and a load value measured by the load cell obtained by moving the moving unit to a vertical direction. [Reference numerals] (AA) Compressive load; (BB) Gap; (CC) Compression die; (DD) Cracks