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METAL COMPLEXES WITH BIPODAL LIGANDS

机译:双键配位金属配合物

摘要

The invention relates to a compound of the Structure 1 wherein Structure 1 contains a metal Met, coordinated to a tetradentate chelating ligand Lig of Structure 2 where V is a bridging unit which contains 1 to 40 atoms from the third, fourth, fifth and/or sixth main group and connects the two ligand moieties L1 and L2, which may be identical or different on each occurrence, covalently to one another, and where the two ligand moieties L1 and L2 satisfy Structure 3 where Cy1 and Cy2, identically or differently on each occurrence, correspond to a substituted or unsubstituted, saturated, unsaturated or aromatic homo- or heterocyclic ring, which is in each case bonded ionically, covalently or coordinatively to the metal via a ring atom or via an atom bonded exocyclically to the homo- or heterocyclic ring; and where L3, identically or differently on each occurrence, is a mono- or bidentate, neutral or monoanionic ligand, and where a is 0, 1 or 2. The present invention describes novel metal complexes with bipolar ligands. Compounds of this type can be employed as functional materials in a number of different applications which can be ascribed to the electronics industry in the broadest sense.
机译:本发明涉及结构1的化合物,其中结构1包含与结构2的四齿螯合配体Lig配位的金属Met,其中V是桥联单元,其包含来自第三,第四,第五和/或来自1至40个原子第六主基团并连接两个配体部分L1和L2,它们在每次出现时可以相同或不同,彼此共价,并且其中两个配体部分L1和L2满足结构3,其中Cy1和Cy2彼此相同或不同出现,对应于取代或未取代的,饱和的,不饱和的或芳族的均杂环或杂环,其分别通过环原子或通过与该均杂环或杂环外键合的原子与金属离子,共价或配位键合环;并且其中L3在每次出现时相同或不同,是单或二齿,中性或单阴离子配体,并且其中a是0、1或2。本发明描述了具有双极性配体的新型金属配合物。这种类型的化合物可以在许多不同的应用中用作功能材料,这些应用可以广义上归因于电子工业。

著录项

  • 公开/公告号KR101135910B1

    专利类型

  • 公开/公告日2012-04-16

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20067008085

  • 申请日2004-10-21

  • 分类号C07F9/58;C07F15/00;

  • 国家 KR

  • 入库时间 2022-08-21 17:08:15

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