structure for cooling Digital Micromirror Device chip in Digital Light Processing projector

摘要

The present invention improves the cooling structure of the DMD chip to reduce the number of assemblies, thereby reducing the weight of the product, reducing the cost of components, and improving the cooling performance.;To this end, the present invention provides a DMD (Digital Micromirror Device) chip mounted on a board having an exposed window for exposing the DMD chip; An intermediate block coupled to the board and having an intermediate window corresponding to an exposure window of the board; And a heat sink coupled to the intermittent block and having a heat transfer portion inserted into an intermediate window of the intermittent block and contacting the exposed DMD chip through an exposure window of the board, To provide a DMD chip cooling structure for a de-elisf projector.;DeLipy Projector, Board, Intermediate Block, Heatsink