Osmium Diboride Compounds and Their Uses

摘要

According to the present invention, the valence electron density and a bond covalently second incompressible, specific for hard materials pole to verify that it can be used as a design parameter. Using this concept, we have improved the hardness to generate a local covalent bond by integrating the boron atom to osmium metal. Other compounds include the osmium and osmium nitride carbide. However, did not attempt to synthesize OsC is successful, OsN has recently been observed by the spectrometer was not obtained in pure form by crystallographic yet. ^[16] and the small size of the electron acceptor boron Because of the nature, we have to compounds of boron and osmium, OsB to hold almost all of the high valence electron density of the metal osmium _{2 could form a} The compound is combined with a high bulk modulus with a high hardness. Despite the crystal structure of the die osmium boride known, the mechanical properties were not good erasing characteristics. ^[17,18] ; The present invention is polishing the surface material or to include a way to cut through the material surface, which is the expression: ; Os _x M _{1 -x} B ₂ ; essentially as osmium compound having a die boride includes contacting the surface of the material consisting of abrasive. Here, M is rhenium, ruthenium or iron, and, x is from 0.01 to 1. However, if x is not a 1, M is rhenium, x is 0.01 to 0.3. Material that can be polished is a material that is not as hard as much as osmium die boride compound. For example, sapphire (2,000 kg / mm ² of hardness), as well as, depending on the hardness of the individual die boride osmium compound used as an abrasive 3,000 kg / mm ² is also a material having a hardness or more may be polished. ; This invention also, by grinding or any substance includes a method for protecting the surface from being cut. This method has the following formula ; Os _x M _{1 -x} B ₂ ; comprises coating the surface with a protective layer containing an osmium compound having a die boride. Here, M is rhenium, ruthenium or iron, and, x is from 0.01 to 1. However, if x is not a 1, M is rhenium, x is 0.01 to 0.3. The protective layer can protect the die from the osmium boride compound as much as non-rigid materials, as discussed above. ; The invention not only includes methods for using the osmium die boride compound, osmium compound, the tool die boride is used, the abrasive, and other devices and systems are also included. Osmium die boride compounds may be used in the same way as the pole rigid material known as diamond, tungsten carbide, etc.. Osmium boride compounds are the same die-hard or ultra-rigid pole desirable properties found in the known extreme hard materials, and many of them come without drawbacks.