首页> 外国专利> Adhesive sheets microanalytical FOR CHIP, microanalytical CHIP AND METHOD FOR THEIR PRODUCTION

Adhesive sheets microanalytical FOR CHIP, microanalytical CHIP AND METHOD FOR THEIR PRODUCTION

机译:微分析芯片用粘合片,微分析芯片及其生产方法

摘要

Disclosed is a microanalysis chip adhesive sheet with an adhesive surface, which can be inexpensively but easily bonded to a substrate at a relatively low temperature, with which fabrication of analysis chips is simplified, and which has the capability of fixing a selective bonding substance to the sheet surface. The microanalysis chip is characterized in that a microanalysis chip adhesive sheet, which comprises a plastic sheet provided with an adhesive layer formed from an adhesive that contains a polymer in which monomer structural units that contain carboxyl radicals or acid anhydride radicals constitute 5‑25% by weight of the [total] monomer structural units in the polymer, and a substrate, which has protrusions and recesses on the surface thereof, are bonded together so that the surface of the substrate having the projections and concavities and the adhesive layer of the aforementioned microanalysis chip adhesive sheet are on the inside. Gaps at the concave parts of the substrate between the substrate and the adhesive layer of the aforementioned microanalysis chip adhesive sheet form a flow path, a part of which is the aforementioned adhesive layer, and a selective bonding substance is fixed to the adhesive layer surface.
机译:本发明公开了一种具有粘合表面的微分析芯片粘合片,其可以廉价地但在相对较低的温度下容易地粘合至基底,从而简化了分析芯片的制造,并且具有将选择性粘合物质固定至表面的能力。板材表面。微分析芯片的特征在于,微分析芯片粘合片包括塑料片,该塑料片具有由粘合剂形成的粘合剂层,该粘合剂层包含含有聚合物的聚合物,其中包含羧基或酸酐基的单体结构单元占5-25%。聚合物中全部[总]单体结构单元的重量与在其表面上具有凸起和凹陷的基底结合在一起,从而使具有凸起和凹陷的基底表面以及上述微分析的粘合剂层芯片粘合片位于内部。在上述微分析芯片粘合片的基板与粘合层之间的基板凹部处的间隙形成流动路径,该流动路径的一部分是上述粘合层,并且选择性粘合物质固定在粘合层表面上。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号