首页> 外国专利> Isothermal cooling system for cooling of i.e. microprocessor of computer, has isothermal vaporization radiators with cooling fins to dissipate heat to environment, where inner cavity of fins comprises vaporization and gas portions

Isothermal cooling system for cooling of i.e. microprocessor of computer, has isothermal vaporization radiators with cooling fins to dissipate heat to environment, where inner cavity of fins comprises vaporization and gas portions

机译:用于冷却即计算机微处理器的等温冷却系统,具有等温汽化散热器,该散热器具有散热片,以将热量散发到环境中,其中散热片的内腔包括气化部分和气体部分

摘要

The system (1) has a cooling arrangement (18) to remove heat from an electronic component (4) i.e. microprocessor, where the heat is conducted to a contact area (20) of a Peltier element (7). Another cooling arrangement (19) cools another contact area (21) of the Peltier element, where the latter contact area is heated by the operation of the Peltier element. Isothermal vaporization radiators (9) with cooling fins (13) are formed on the latter contact area to dissipate the heat to environment, where an inner cavity of the fins comprises a vaporization portion (15) and a gas portion (16).
机译:系统(1)具有冷却装置(18),以从电子部件(4)即微处理器中除去热量,其中,热量被传导至珀尔帖元件(7)的接触区域(20)。另一冷却装置(19)冷却珀尔帖元件的另一接触区域(21),其中,该后接触区域通过珀尔帖元件的操作被加热。具有散热片(13)的等温汽化散热器(9)形成在后者的接触区域上,以将热量散发到环境中,其中,散热片的内腔包括汽化部分(15)和气体部分(16)。

著录项

  • 公开/公告号DE102010020932A1

    专利类型

  • 公开/公告日2011-11-24

    原文格式PDF

  • 申请/专利权人 WOLF EUGEN;

    申请/专利号DE20101020932

  • 发明设计人 SPOMER MAXIM;HERDT TATJANA;WOLF EUGEN;

    申请日2010-05-19

  • 分类号H05K7/20;H01L23/38;G06F1/20;

  • 国家 DE

  • 入库时间 2022-08-21 17:05:36

相似文献

  • 专利
  • 外文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号