Method for manufacturing hermetic housing for microsystem e.g. microelectromechanical system (MEMS), involves placing base with lid in protective atmosphere, and forming adhesive joint between base and lid

摘要

A cavity for a component to be encapsulated is arranged between a base (22) and a lid (23). The base is placed with the lid in a protective atmosphere. An adhesive joint is produced as joint between the base and the lid. Another joint is formed between the base and lid, for hermetic encapsulation of cavity from outside. An independent claim is included for hermetic housing.