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Processing substrate e.g. tape substrate, by applying material onto substrate and/or removing material from substrate, and carrying out heat transfer between heating or cooling body and substrate simultaneously and/or at different time
Processing substrate e.g. tape substrate, by applying material onto substrate and/or removing material from substrate, and carrying out heat transfer between heating or cooling body and substrate simultaneously and/or at different time
The method comprises applying a material onto a substrate (6) and/or removing the material from the substrate, carrying out a heat transfer between a heating or cooling body and the substrate simultaneously and/or at a different time, where the heat between the substrate and the heating or cooling body is directed by a heat conductive textile material, and simultaneously moving the substrate and the heating or cooling body so that no relative displacement between the heating or cooling body and substrate takes place. The method is carried out under sub-atmospheric pressure. An independent claim is included for an apparatus for processing a substrate.
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