首页> 外国专利> Processing substrate e.g. tape substrate, by applying material onto substrate and/or removing material from substrate, and carrying out heat transfer between heating or cooling body and substrate simultaneously and/or at different time

Processing substrate e.g. tape substrate, by applying material onto substrate and/or removing material from substrate, and carrying out heat transfer between heating or cooling body and substrate simultaneously and/or at different time

机译:处理基板通过将材料施加到基材上和/或从基材上除去材料,并同时和/或在不同的时间进行加热或冷却体与基材之间的热传递,将胶带基材

摘要

The method comprises applying a material onto a substrate (6) and/or removing the material from the substrate, carrying out a heat transfer between a heating or cooling body and the substrate simultaneously and/or at a different time, where the heat between the substrate and the heating or cooling body is directed by a heat conductive textile material, and simultaneously moving the substrate and the heating or cooling body so that no relative displacement between the heating or cooling body and substrate takes place. The method is carried out under sub-atmospheric pressure. An independent claim is included for an apparatus for processing a substrate.
机译:该方法包括将材料施加到衬底(6)上和/或从衬底上去除材料,同时和/或在不同时间在加热或冷却体与衬底之间进行热传递,其中基底和加热或冷却体由导热的纺织材料引导,并且同时移动基底和加热或冷却体,从而在加热或冷却体与基底之间不发生相对位移。该方法在低于大气压的压力下进行。包括用于处理基板的设备的独立权利要求。

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