Micro-mechanical arrangement for manufacturing thin polysilicon layer utilized as e.g. strip conductor, has hole pairs connected with micro-mechanical functional area over contact plugs and disconnected from area by gap

摘要

The arrangement has a micro-mechanical functional area (P1a) i.e. polysilicon functional region, arranged in a plane above a silicon substrate (S). A sub region is attached on the micro-mechanical functional area and connected with another sub region, where the former sub region is formed in bar shape. The latter sub region is connected with the substrate. Hole pairs are reciprocally arranged between the sub regions and connected with the functional area over contact plugs. The hole pairs are disconnected from the functional area by a gap that is formed between the hole pairs. An independent claim is also included for a method for manufacturing a micro-mechanical device.