首页> 外国专利> Arrangement for monitoring and controlling of plasma etching process of workpiece, has image processing and simulation device that controls operation of ion beam source based on the measurement data of locator and detector array

Arrangement for monitoring and controlling of plasma etching process of workpiece, has image processing and simulation device that controls operation of ion beam source based on the measurement data of locator and detector array

机译:用于监视和控制工件的等离子体蚀刻过程的装置,具有图像处理和模拟装置,其基于定位器和检测器阵列的测量数据来控制离子束源的操作

摘要

The arrangement has a vacuum chamber (1) in which workpiece (4) is provided. An ion beam source (2) is coupled with vacuum chamber for supplying ion beam (3) with respect to workpiece. The position of the workpiece is measured by a locator (9). A detector array (17) is provided to collect light beam (14) reflected by the workppiece. An image processing and simulation device (18) is provided for controlling the operation of ion beam source based on measurement data (22) of locator and measurement data (23) of detector array.
机译:该装置具有真空室(1),在该真空室中提供有工件(4)。离子束源(2)与真空室耦合,用于相对于工件供应离子束(3)。工件的位置由定位器(9)测量。提供检测器阵列(17)以收集由工件反射的光束(14)。提供了一种图像处理和模拟装置(18),用于基于定位器的测量数据(22)和检测器阵列的测量数据(23)来控制离子束源的操作。

著录项

  • 公开/公告号DE102011014866A1

    专利类型

  • 公开/公告日2012-09-27

    原文格式PDF

  • 申请/专利权人 CARL ZEISS JENA GMBH;

    申请/专利号DE20111014866

  • 申请日2011-03-24

  • 分类号G01N21/17;G01N21/25;G01N21/47;

  • 国家 DE

  • 入库时间 2022-08-21 17:04:58

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