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Air guide for electrical components arranged on printed circuit board of memory modules of computer server, has roof that is formed with one flap by bending portion of roof along bending edge in direction of proposed placement site
Air guide for electrical components arranged on printed circuit board of memory modules of computer server, has roof that is formed with one flap by bending portion of roof along bending edge in direction of proposed placement site
The air guide (1) has two side walls (3) arranged for placing on a component side of a printed circuit board. The side walls are connected together by a roof (2). The roof is formed with one flap (5) formed by bending a portion of the roof along a bending edge (4) in the direction of the proposed placement site. An opening (6) is formed by bending the flap. An independent claim is included for method for manufacturing air guide.
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