Active optical connection e.g. active optical cable, producing method for motherboard of computer, involves moving mold by highly precisely repeatably positioning machine, where carrier substrate is removed from positioning machine

摘要

The method involves arranging a carrier substrate in a highly precisely repeatably positioning machine i.e. flip-chip machine. An optoelectronic element is mounted on the carrier substrate by the highly precisely repeatably positioning machine. A curable, moldable compound is applied over the optoelectronic element. The moldable compound is molded by a mold for molding a light deflection unit (4), where the mold is moved by the highly precisely repeatably positioning machine. The carrier substrate is removed from the highly precisely repeatably positioning machine. An independent claim is also included for an active optical connection comprising an optoelectronic element.