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Preparation of composite component used for mechanical sealing and drawing die, involves forming layer containing silicide, carbide, boride, carbonitride, nitride of metal or its alloy, organic binder and diamond crystals on substrate
Preparation of composite component used for mechanical sealing and drawing die, involves forming layer containing silicide, carbide, boride, carbonitride, nitride of metal or its alloy, organic binder and diamond crystals on substrate
A layer containing silicide, carbide, boride, carbonitride, nitride of metal or its alloy, organic binder and diamond crystals is formed on a substrate made of silicon carbide or ceramic precursor. The coated substrate is thermally-treated in inert atmosphere under vacuum condition, to from wear-resistant layer on its surface, to obtain composite component. The organic binder in the layer is thermally-decomposed and silicon or its alloy is infiltrated at less than 1650[deg] C in an inert atmosphere under vacuum condition. A layer containing silicide, carbide, boride, carbonitride, nitride of metal or its alloy, organic binder and diamond crystals is formed on a substrate made of silicon carbide or ceramic precursor. The coated substrate is thermally-treated in inert atmosphere under vacuum condition, to from wear-resistant layer on its surface, to obtain composite component. The organic binder in the layer is thermally-decomposed and silicon or its alloy is infiltrated at less than 1650[deg] C in an inert atmosphere under vacuum condition. The diamond particles are decomposed to carbon which is then combined with silicon, to form beta -silicon carbide particles. The wear-resistant layer contains 30 %mass or more of diamond crystals and 30 %mass or more of beta -silicon carbide.
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