首页> 外国专利> Substrate system consisting of a metamorphic transition region comprising a laminate of AlxGa1-x N and the same material as the substrate.

Substrate system consisting of a metamorphic transition region comprising a laminate of AlxGa1-x N and the same material as the substrate.

机译:由变质过渡区组成的衬底系统,该过渡区包括AlxGa1-x N的叠层以及与衬底相同的材料。

摘要

A laminated substrate system containing a metamorphic transition buffer layer 2 made from a plurality of alternating layers of AlxGa1-xN (5) and a material of the same chemical composition as the supporting substrate material 1. The material AlxGa1-xN has a value of x according to 0 ¤ x ¤ 1. A III-Nitrides semiconductor device 3 with a low dislocation density is formed on top of the laminated substrate system. The multiple layers (4,5, fig 2) of the metamorphic transition region form a superlattice structure whose composition and lattice constant and thickness changes along its growth direction from that of the supporting substrate 1, in the vicinity of the supporting substrate, to that of the device 3 , in the vicinity of the device. The substrate preferably comprises of sapphire, silicon (Si) , silicon carbide (SiC) or gallium arsenide (GaAs). In the case of the sapphire substrate the metamorphic transition region comprises alternating layers of Al2O3 and AlxGa1-xN. The thickness of the layers constituting the metamorphic transition region is kept below the threshold where threading dislocations become present, thus limiting the growth of 3D crystals. In one embodiment having a sapphire substrate, the initial thickness of the Al2O3 layer is 5nm and that of the GaN layer is 0.3nm. Conversely the 92nd layer comprises a 0.3nm Al2O3 layer and a 5nm GaN layer. Deposition of the materials can be made by MOVPE, MBE, ALD. The invention finds applications in light emitting diodes (LEDs) , laser diodes, solar cells , heterostructure field effect transistors (HFETs) and high electron mobility transistors (HEMT).
机译:叠层基板系统,包含由多个交替的AlxGa1-xN层(5)和化学成分与支撑基板材料1相同的材料制成的变质过渡缓冲层2。材料AlxGa1-xN的值为x根据0¤x¤1.在层叠衬底系统的顶部上形成具有低位错密度的III族氮化物半导体器件3。变质过渡区的多层(4,5,图2)形成一个超晶格结构,其组成和晶格常数以及厚度沿着其生长方向从支撑衬底1的附近(在支撑衬底附近)变化到在设备附近的设备3的顶部。衬底优选地包括蓝宝石,硅(Si),碳化硅(SiC)或砷化镓(GaAs)。在蓝宝石衬底的情况下,变质过渡区包括Al 2 O 3和Al x Ga 1-x N的交替层。构成变质过渡区的层的厚度保持在阈值以下,在该阈值处出现螺纹位错,从而限制了3D晶体的生长。在具有蓝宝石衬底的一个实施例中,Al 2 O 3层的初始厚度为5nm,而GaN层的初始厚度为0.3nm。相反,第92层包括0.3nm的Al 2 O 3层和5nm的GaN层。材料的沉积可以通过MOVPE,MBE,ALD进行。本发明在发光二极管(LED),激光二极管,太阳能电池,异质结构场效应晶体管(HFET)和高电子迁移率晶体管(HEMT)中得到应用。

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