首页> 外国专利> EARPHONE JACK STRUCTURE AND EARPHONE JACK CONFIGURATION METHOD

EARPHONE JACK STRUCTURE AND EARPHONE JACK CONFIGURATION METHOD

机译:耳机插孔的结构和耳机插孔的配置方法

摘要

PROBLEM TO BE SOLVED: To provide a technology which enables a substrate to hold an earphone plug thereby achieving further thickness reduction of a terminal device.SOLUTION: An earphone jack structure of this invention includes: a substrate where contacts are arranged at positions which allow the contacts to respectively contact with multiple electrodes of an earphone plug when the earphone plug is inserted; and a housing where a substantially semicircular earphone plug insertion port upper part is formed so that the earphone plug can be inserted thereinto, the housing having a plug holding part holding the earphone plug when the earphone plug is inserted.
机译:解决的问题:提供一种使基板能够保持耳机插头从而进一步减小终端装置的厚度的技术。解决方案:本发明的耳机插孔结构包括:基板,在该基板上,触头布置在允许接触的位置。插入耳机插头时,触点分别与耳机插头的多个电极接触;壳体具有形成为大致半圆形的耳机插头插入口上部以便能够将耳机插头插入其中的壳体,该壳体具有插头保持部,该插头保持部在插入耳机插头时保持耳机插头。

著录项

  • 公开/公告号JP2013191293A

    专利类型

  • 公开/公告日2013-09-26

    原文格式PDF

  • 申请/专利权人 NEC ACCESS TECHNICA LTD;

    申请/专利号JP20120054664

  • 发明设计人 TAKAHASHI TATSU;

    申请日2012-03-12

  • 分类号H01R24/58;H01R12/71;

  • 国家 JP

  • 入库时间 2022-08-21 17:03:02

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号