WORKING MONITORING DEVICE AND WORKING MONITORING METHOD

摘要

PROBLEM TO BE SOLVED: To provide detection or the like by which a physical fault is eliminated by non-contact type error detection, and which deals with decrease of detection due to the secular change of a laser beam machining head, which is caused when making the detection into a non-contact type, and with new base stock of a workpiece or the like.SOLUTION: The monitoring device 31 performs monitoring to the machining of a workpiece W. The device includes a detecting part 11a for detecting light which is produced when machining the workpiece W and a controller 33 for setting a specified gain on the basis of detected results by the detecting part 11a. The controller 33 performs a predetermined calculation by making the dividing magnification which is divided into the plural number change to the detected results by the number of divisions and executes extracting process for extracting the dividing magnification when calculated results fall within an allowable value; and the extracting process is executed by the setting number of times and the dividing magnification which is extracted most is taken as the specified gain.