首页> 外国专利> LAMINATED BODY, ELECTRONIC DEVICE EQUIPPED WITH THE LAMINATED BODY, PIEZOELECTRIC DEVICE, PIEZOELECTRIC MODULE EQUIPPED WITH THE PIEZOELECTRIC DEVICE, AND MANUFACTURING METHOD OF ELECTRONIC APPARATUS AND THE LAMINATED BODY

LAMINATED BODY, ELECTRONIC DEVICE EQUIPPED WITH THE LAMINATED BODY, PIEZOELECTRIC DEVICE, PIEZOELECTRIC MODULE EQUIPPED WITH THE PIEZOELECTRIC DEVICE, AND MANUFACTURING METHOD OF ELECTRONIC APPARATUS AND THE LAMINATED BODY

机译:叠层体,装有叠层体的电子设备,压电设备,装有压电设备的压电模块以及电子设备和叠层体的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a laminated body for preventing a bonding material from sticking out from a bonding surface in a laminated structure made by superimposing and bonding a plurality of substrates, an electronic device equipped with the laminated body, a piezoelectric device, a piezoelectric module equipped with the piezoelectric deice, and a manufacturing method of an electronic apparatus and the laminated body.;SOLUTION: A pressure sensor 1 includes a pressure sensitive element layer 10, a diaphragm layer 20, and a base layer 30 which are laminated and bonded by a bonding material 40. Groove portions 102a and 102b are formed in a frame portion 108 of the pressure sensitive element layer 10. A groove portion 208 is formed in a frame portion 206 on the other main surface side of the diaphragm layer 20, and a groove portion 306 is formed in a frame portion 304 on one main surface side of the base layer 30. The groove portion 208 is disposed by being shifted so as not to oppose to the groove portion 102a, and the groove portion 306 is disposed by being shifted so as not to oppose to the groove portion 102b.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种层叠体,该层叠体用于防止通过将多个基板重叠并粘合而形成的层叠结构中的粘合材料从粘合表面突出。压电组件,压电器件,电子设备和层叠体的制造方法。解决方案:压力传感器1包括压敏元件层10,隔膜层20和基层30,它们被层叠并通过粘合材料40粘合。在压敏元件层10的框架部分108中形成凹槽部分102a和102b。在隔膜层20的另一主表面侧上的框架部分206中形成凹槽部分208,并且,在基层30的一个主表面侧的框部304上形成有槽部306。槽部208通过不错开地配置而配置。槽部分102a与槽部分102a相对应,并且槽部分306通过移位而布置成不与槽部分102b相对。;版权:(C)2013,日本特许厅&INPIT

著录项

  • 公开/公告号JP2012247288A

    专利类型

  • 公开/公告日2012-12-13

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORP;

    申请/专利号JP20110118808

  • 发明设计人 SAIDA HIROYASU;

    申请日2011-05-27

  • 分类号G01L9;H01L41/08;H01L41/18;H01L41/09;H01L41/22;H01L41/187;

  • 国家 JP

  • 入库时间 2022-08-21 17:01:42

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