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HEAT CONDUCTIVE RESIN COMPOSITION FOR LED ILLUMINATION SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND LED ILLUMINATION SUBSTRATE
HEAT CONDUCTIVE RESIN COMPOSITION FOR LED ILLUMINATION SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND LED ILLUMINATION SUBSTRATE
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机译:LED照明基板用导热性树脂组合物,其制造方法以及LED照明基板
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摘要
PROBLEM TO BE SOLVED: To provide a heat conductive resin composition for LED illumination substrate, capable of improving heat conductivity and insulating properties regardless of the large amount of inorganic filler, such as magnesium oxide.;SOLUTION: In a heat conductive resin composition for LED illumination substrate containing a resin and inorganic filler, the inorganic filler contains at least a magnesium oxide, the content of the inorganic filler is ≥50 vol.% and 95 vol.% based on the total amount of the heat conductive resin composition for LED illumination substrate. A weight increasing ratio is 5% after a cured product of the heat conductive resin composition for LED illumination substrate being left for 500 hours under an atmosphere at 85°C of a temperature and 85% of relative humidity.;COPYRIGHT: (C)2014,JPO&INPIT
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