首页> 外国专利> HEAT CONDUCTIVE RESIN COMPOSITION FOR LED ILLUMINATION SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND LED ILLUMINATION SUBSTRATE

HEAT CONDUCTIVE RESIN COMPOSITION FOR LED ILLUMINATION SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND LED ILLUMINATION SUBSTRATE

机译:LED照明基板用导热性树脂组合物,其制造方法以及LED照明基板

摘要

PROBLEM TO BE SOLVED: To provide a heat conductive resin composition for LED illumination substrate, capable of improving heat conductivity and insulating properties regardless of the large amount of inorganic filler, such as magnesium oxide.;SOLUTION: In a heat conductive resin composition for LED illumination substrate containing a resin and inorganic filler, the inorganic filler contains at least a magnesium oxide, the content of the inorganic filler is ≥50 vol.% and 95 vol.% based on the total amount of the heat conductive resin composition for LED illumination substrate. A weight increasing ratio is 5% after a cured product of the heat conductive resin composition for LED illumination substrate being left for 500 hours under an atmosphere at 85°C of a temperature and 85% of relative humidity.;COPYRIGHT: (C)2014,JPO&INPIT
机译:要解决的问题:提供一种用于LED照明基板的导热性树脂组合物,无论大量的无机填料,例如氧化镁,该导热性树脂组合物都能够提高导热性和绝缘性。包含树脂和无机填料的照明基板,无机填料至少包含氧化镁,基于LED用导热性树脂组合物的总量,无机填料的含量≥50%(体积)且<95%(体积)照明基板。将LED照明基板用导热性树脂组合物的固化产物在85°C的温度和85%的相对湿度的气氛下放置500小时后,增重比<5%。 2014年,日本特许厅&INPIT

著录项

  • 公开/公告号JP2013209609A

    专利类型

  • 公开/公告日2013-10-10

    原文格式PDF

  • 申请/专利权人 PANASONIC CORP;

    申请/专利号JP20120224429

  • 申请日2012-10-09

  • 分类号C08L101/00;C08K3/00;C08J3/20;H05K1/03;

  • 国家 JP

  • 入库时间 2022-08-21 17:01:30

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