Gold-plating membrane structure, being the gold-plating membrane structure which was formed to the glass ceramic wiring

摘要

PROBLEM TO BE SOLVED: To reduce the occurrence of problems such as a glitch of abnormal deposition of gold in between wiring patterns of a LTCC substrate, poor adhesion between a gold film and a nickel plating film, a phenomenon of repelling solder, and a strength deterioration of a soldered joint.;SOLUTION: A structure of a gold plating film comprises: a first layer structure of a nickel-phosphorus alloy formed on a wiring pattern of a metallic sintered compact by using an electroless nickel plating solution which uses approximately neutral hypophosphite as a reducing agent; a second layer structure of a nickel-phosphorous alloy that is amorphous and does not contain sulfur, which is formed on the first layer structure by using an electroless nickel plating solution that forms such a layer structure as to contain 7 wt.% or more phosphorous and not to contain a sulfur component; a third layer structure of gold formed on the second layer structure by using a displacement type electroless gold plating solution; and a fourth layer structure of gold formed on the third layer structure by using a reduction type electroless gold plating solution.;COPYRIGHT: (C)2009,JPO&INPIT